Description
- Company Name:
- Spansion
- Position Type:
- Full-time
- Desired Experience:
- 5 - 7
Develops Wafer Fab plasma etch processes for 45nm and 32nm technology nodes that provide more tightly controlled parameters to allow the design of improved device technology or better yield and/or throughput capacity on existing or new device technology.
Detailed proficiency on leading plasma etch equipment used in the industry.
Strong process engineering skills with core competencies in process development, use of advanced metrology and integration with lithography process.
Knowledge of semiconductor manufacturing and process integration required.
A technology related Bachelor's degree in engineering, chemistry, physics, or physical sciences required plus 7 years related experience including experience in new process development. A Master's degree plus 5 years experience or doctorate degree is preferred and may reduce the minimum experience required. Advanced degrees in physics or chemistry preferred.

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